Microlithography: Science and Technology, Second Edition (Opitcal Science and Engineering Book 126) (English Edition)

Microlithography: Science and Technology, Second Edition (Opitcal Science and Engineering Book 126) (English Edition)

作者
Bruce W. Smith、Kazuaki Suzuki
语言
英语
出版社
CRC Press
出版日期
2018年10月3日
纸书页数
864页
电子书格式
epub,pdf,mobi,azw3,txt,fb2,djvu
文件大小
47543 KB
下载次数
2731
更新日期
2023-04-06
运行环境
PC/Windows/Linux/Mac/IOS/iPhone/iPad/iBooks/Kindle/Android/安卓/平板
内容简介

This new edition of the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from the world's leading academic and industrial laboratories detailed by a stellar panel of international experts.New in the Second EditionIn addition to updated information on existing material, this new edition features coverage of technologies developed over the last decade since the first edition appeared, including:

Immersion Lithography

157nm Lithography

Electron Projection Lithography (EPL)

Extreme Ultraviolet (EUV) Lithography

Imprint Lithography

Photoresists for 193nm and Immersion Lithography

Scatterometry

Microlithography: Science and Technology, Second Edition authoritatively covers the physics, chemistry, optics, metrology tools and techniques, resist processing and materials, and fabrication methods involved in the latest generations of microlithography such as immersion lithography and extreme ultraviolet (EUV) lithography. It also looks ahead to the possible future systems and technologies that will bring the next generations to fruition.Loaded with illustrations, equations, tables, and time-saving references to the most current literature, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to achieve robust, accurate, and cost-effective microlithography processes and systems.

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